Kinsus Interconnect Technology Corporation selects Heidelberg Instruments to support its advanced photomask production
Heidelberg, Germany, September 09, 2011: Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from the Taiwan based Kinsus Interconnect Technology Corp . VPG 800 is an ideal for high volume production of today’s demanding photomasks for various applications, including the advanced electronic packaging.
With a number of productions facilities globally, Kinsus Interconnect Technology Corporation is a major manufacturer of plastic ball grid array (BGA) substrates, multi-chip-modules (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and chip on flex (COF), among others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others.
“The opportunity to extend our support of Kinsus Interconnect production needs is a testimony to the strength of our VPG family of systems, which features field-proven, economic, reliable and high-volume capabilities. We value the confidence Kinsus Interconnect Corp has placed in our Maskless Lithography Systems and look forward to a long term relationship and future collaborations.” states Alexander Forozan, Head of Global Sales and Business Development, Heidelberg Instruments
About Heidelberg Instruments, GmbH: With an installation base in over 30 countries, Heidelberg Instruments is a world leader in production of high precision maskless lithography systems. These systems are used for direct writing and photomask production by some of the most prestigious universities and industry leaders in the areas of MEMS, BioMEMS, Nano Technology, ASICS, TFT, Plasma Displays, Micro Optics, and many other related applications.