Heidelberg Instruments provides lithography platform for Wafer Level Packaging
Heidelberg, Germany, November 23, 2013: Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a leading Asian based semiconductor packaging group. The System will be used in production of advanced semiconductor and wafer level packaging devices used in the production of consumer products such as Smartphones,Tablets, Ultrabooks, e-Readers, GPS, Portable Game Consoles, Camcorders and LCD Modules.
“Reduced package size enables components to be used in a variety of advanced products. Need for smaller component size, especially reduced package height, is a main market driver for wafer-level packaging. The VPG platform will present an advanced, reliable, and economical lithography solution for the lithography process used in fabrication advanced electronic packaging.” states Alexander Forozan, Head of Global Sales and Business Development, Heidelberg Instruments
About Heidelberg Instruments, GmbH: With an installation base in over 40 countries, Heidelberg Instruments is a world leader in production of high precision maskless lithography systems. These systems are used for direct writing and photomask production by some of the most prestigious universities and industry leaders in the areas of MEMS, BioMEMS, Nano Technology, ASICS, TFT, Plasma Displays, Micro Optics, and many other related applications.